M29F200BB70M3T
vs
AM29F200BB-55EE
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NUMONYX
|
SPANSION INC
|
| Part Package Code |
SOIC
|
TSOP1
|
| Package Description |
SOP,
|
TSSOP, TSSOP48,.8,20
|
| Pin Count |
44
|
48
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| ECCN Code |
EAR99
|
3A001.A.2.C
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Access Time-Max |
70 ns
|
55 ns
|
| Alternate Memory Width |
8
|
8
|
| Boot Block |
BOTTOM
|
BOTTOM
|
| JESD-30 Code |
R-PDSO-G44
|
R-PDSO-G48
|
| JESD-609 Code |
e3
|
e0
|
| Length |
28.5 mm
|
18.4 mm
|
| Memory Density |
2097152 bit
|
2097152 bit
|
| Memory IC Type |
FLASH
|
FLASH
|
| Memory Width |
16
|
16
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
44
|
48
|
| Number of Words |
131072 words
|
131072 words
|
| Number of Words Code |
128000
|
128000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Organization |
128KX16
|
128KX16
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
TSSOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Programming Voltage |
5 V
|
5 V
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
3 mm
|
1.2 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
MILITARY
|
| Terminal Finish |
Matte Tin (Sn)
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Type |
NOR TYPE
|
NOR TYPE
|
| Width |
12.6 mm
|
12 mm
|
| Base Number Matches |
1
|
2
|
| Pbfree Code |
|
No
|
| Additional Feature |
|
MIN 1000K WRITE/ERASE CYCLE ;20 YEAR DATA RETENTION; BOTTOM BOOT BLOCK
|
| Command User Interface |
|
YES
|
| Data Polling |
|
YES
|
| Data Retention Time-Min |
|
20
|
| Endurance |
|
1000000 Write/Erase Cycles
|
| Moisture Sensitivity Level |
|
3
|
| Number of Sectors/Size |
|
1,2,1,3
|
| Package Equivalence Code |
|
TSSOP48,.8,20
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Ready/Busy |
|
YES
|
| Sector Size |
|
16K,8K,32K,64K
|
| Standby Current-Max |
|
0.000005 A
|
| Supply Current-Max |
|
0.06 mA
|
| Toggle Bit |
|
YES
|
|
|
|
Compare M29F200BB70M3T with alternatives
Compare AM29F200BB-55EE with alternatives