M29F200B-150N1TR vs AM29F200BB45EC feature comparison

M29F200B-150N1TR STMicroelectronics

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AM29F200BB45EC Spansion

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer STMICROELECTRONICS SPANSION INC
Part Package Code TSOP TSOP
Package Description 12 X 20 MM, PLASTIC, TSOP-48 TSOP-48
Pin Count 48 48
Reach Compliance Code unknown compliant
ECCN Code EAR99
HTS Code 8542.32.00.51
Access Time-Max 150 ns 45 ns
Alternate Memory Width 16
Boot Block BOTTOM
JESD-30 Code R-PDSO-G48 R-PDSO-G48
Length 18.4 mm
Memory Density 2097152 bit 2097152 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 48 48
Number of Words 262144 words 262144 words
Number of Words Code 256000 256000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 256KX8 256KX8
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSOP1 SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE SMALL OUTLINE
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 5 V 5 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm
Supply Voltage-Max (Vsup) 5.5 V 5.25 V
Supply Voltage-Min (Vsup) 4.5 V 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology MOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm
Terminal Position DUAL DUAL
Type NOR TYPE
Width 12 mm
Base Number Matches 1 2
Rohs Code No
Additional Feature CONFG AS 128K X 16; BOTTOM BOOT BLOCK
JESD-609 Code e0
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 240
Terminal Finish TIN LEAD
Time@Peak Reflow Temperature-Max (s) 30

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Compare AM29F200BB45EC with alternatives