M29F160BB55N1T
vs
M29F160FT55N6T2
feature comparison
All Stats
Differences Only
Rohs Code
No
No
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
NUMONYX
MICRON TECHNOLOGY INC
Part Package Code
TSOP
Package Description
12 X 20 MM, PLASTIC, TSOP-48
TSOP1,
Pin Count
48
Reach Compliance Code
not_compliant
unknown
ECCN Code
EAR99
HTS Code
8542.32.00.51
Access Time-Max
55 ns
55 ns
Additional Feature
BOTTOM BOOT BLOCK
TOP BOOT BLOCK
Alternate Memory Width
8
8
Boot Block
BOTTOM
JESD-30 Code
R-PDSO-G48
R-PDSO-G48
JESD-609 Code
e0
Length
18.4 mm
18.4 mm
Memory Density
16777216 bit
16777216 bit
Memory IC Type
FLASH
FLASH
Memory Width
16
16
Number of Functions
1
1
Number of Terminals
48
48
Number of Words
1048576 words
1048576 words
Number of Words Code
1000000
1000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
1MX16
1MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSOP1
TSOP1
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE
SMALL OUTLINE, THIN PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
5 V
5 V
Qualification Status
Not Qualified
Seated Height-Max
1.2 mm
1.2 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
DUAL
DUAL
Type
NOR TYPE
Width
12 mm
12 mm
Base Number Matches
2
2
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Screening Level
AEC-Q100
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare M29F160BB55N1T with alternatives
Compare M29F160FT55N6T2 with alternatives