M29F080D55M6F
vs
AM29F080B-55SI
feature comparison
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
NUMONYX
|
CYPRESS SEMICONDUCTOR CORP
|
| Part Package Code |
SOIC
|
|
| Package Description |
0.525 INCH, LEAD FREE, PLASTIC, SOP-44
|
MO-180AA, SOP-44
|
| Pin Count |
44
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Access Time-Max |
55 ns
|
55 ns
|
| JESD-30 Code |
R-PDSO-G44
|
R-PDSO-G44
|
| JESD-609 Code |
e3/e4
|
e0
|
| Length |
28.2 mm
|
28.2 mm
|
| Memory Density |
8388608 bit
|
8388608 bit
|
| Memory IC Type |
FLASH
|
FLASH
|
| Memory Width |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
44
|
44
|
| Number of Words |
1048576 words
|
1048576 words
|
| Number of Words Code |
1000000
|
1000000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
1MX8
|
1MX8
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
SOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Peak Reflow Temperature (Cel) |
245
|
|
| Programming Voltage |
5 V
|
5 V
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
2.8 mm
|
2.8 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.25 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.75 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN/NICKEL PALLADIUM GOLD
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Type |
NOR TYPE
|
NOR TYPE
|
| Width |
13.3 mm
|
13.3 mm
|
| Base Number Matches |
2
|
3
|
| Rohs Code |
|
No
|
|
|
|
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