M29F002BNT55N3F
vs
AM29F002BT-55EF
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
NUMONYX
CYPRESS SEMICONDUCTOR CORP
Part Package Code
TSOP
Package Description
8 X 20 MM, LEAD FREE, PLASTIC, TSOP-32
LEAD FREE, MO-142BBD, TSOP-32
Pin Count
32
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
55 ns
55 ns
Additional Feature
TOP BOOT BLOCK
TOP BOOT BLOCK
Boot Block
TOP
TOP
JESD-30 Code
R-PDSO-G32
R-PDSO-G32
JESD-609 Code
e3/e6
Length
18.4 mm
18.4 mm
Memory Density
2097152 bit
2097152 bit
Memory IC Type
FLASH
FLASH
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
32
32
Number of Words
262144 words
262144 words
Number of Words Code
256000
256000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
256KX8
256KX8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSOP1
TSSOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
260
Programming Voltage
5 V
5 V
Qualification Status
Not Qualified
Seated Height-Max
1.2 mm
1.2 mm
Supply Current-Max
0.02 mA
Supply Voltage-Max (Vsup)
5.5 V
5.25 V
Supply Voltage-Min (Vsup)
4.5 V
4.75 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
INDUSTRIAL
Terminal Finish
TIN/TIN BISMUTH
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
40
Type
NOR TYPE
NOR TYPE
Width
8 mm
8 mm
Base Number Matches
2
3
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