M29DW641F60ZE1 vs M29DW641F60ZE6T feature comparison

M29DW641F60ZE1 STMicroelectronics

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M29DW641F60ZE6T Micron Technology Inc

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer STMICROELECTRONICS MICRON TECHNOLOGY INC
Part Package Code BGA
Package Description 6 X 8 MM, 0.80 MM PITCH, TFBGA-48 FBGA, BGA48,6X8,32
Pin Count 48
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 60 ns 60 ns
Additional Feature 100,000 PROGRAM/ERASE CYCLES
Boot Block BOTTOM/TOP BOTTOM/TOP
JESD-30 Code R-PBGA-B48 R-PBGA-B48
JESD-609 Code e0
Length 8 mm
Memory Density 67108864 bit 67108864 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Number of Functions 1
Number of Terminals 48 48
Number of Words 4194304 words 4194304 words
Number of Words Code 4000000 4000000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 4MX16 4MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA FBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 3 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 2.7 V
Supply Voltage-Nom (Vsup) 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Type NOR TYPE NOR TYPE
Width 6 mm
Base Number Matches 2 3
Command User Interface YES
Common Flash Interface YES
Data Polling YES
Number of Sectors/Size 16,126
Package Equivalence Code BGA48,6X8,32
Page Size 8 words
Ready/Busy YES
Sector Size 4K,32K
Standby Current-Max 0.0001 A
Supply Current-Max 0.02 mA
Toggle Bit YES

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