M29DW640F70N1E vs AM29LV641GH73EF feature comparison

M29DW640F70N1E STMicroelectronics

Buy Now Datasheet

AM29LV641GH73EF Spansion

Buy Now Datasheet
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer STMICROELECTRONICS SPANSION INC
Part Package Code TSOP TSOP1
Package Description 12 X 20 MM, LEAD FREE, PLASTIC, TSOP-48 MO-142DD, TSOP-48
Pin Count 48 48
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 70 ns 70 ns
Additional Feature 100,000 PROGRAM/ERASE CYCLES
Alternate Memory Width 8
Boot Block BOTTOM/TOP BOTTOM/TOP
JESD-30 Code R-PDSO-G48 R-PDSO-G48
JESD-609 Code e3/e6 e3
Length 18.4 mm 18.4 mm
Memory Density 67108864 bit 67108864 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 48 48
Number of Words 4194304 words 4194304 words
Number of Words Code 4000000 4000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 4MX16 4MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSOP1 TSOP1
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260
Programming Voltage 3 V 3 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish TIN/TIN BISMUTH MATTE TIN
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 40
Type NOR TYPE NOR TYPE
Width 12 mm 12 mm
Base Number Matches 1 1
Moisture Sensitivity Level 3

Compare M29DW640F70N1E with alternatives

Compare AM29LV641GH73EF with alternatives