M29DW324DT70ZE1F vs MBM29LV320BE10PBT feature comparison

M29DW324DT70ZE1F STMicroelectronics

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MBM29LV320BE10PBT FUJITSU Semiconductor Limited

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Rohs Code Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer STMICROELECTRONICS FUJITSU SEMICONDUCTOR AMERICA INC
Part Package Code BGA BGA
Package Description 6 X 8 MM, 0.80 MM PITCH, LEAD FREE, TFBGA-48 TFBGA,
Pin Count 48 63
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 70 ns 100 ns
Additional Feature TOP BOOT BLOCK
Alternate Memory Width 8 8
Boot Block TOP BOTTOM
JESD-30 Code R-PBGA-B48 R-PBGA-B48
JESD-609 Code e1
Length 8 mm 11 mm
Memory Density 33554432 bit 33554432 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 48 48
Number of Words 2097152 words 2097152 words
Number of Words Code 2000000 2000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 2MX16 2MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA TFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 3 V 3 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.05 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Type NOR TYPE NOR TYPE
Width 6 mm 7 mm
Base Number Matches 1 1

Compare M29DW324DT70ZE1F with alternatives

Compare MBM29LV320BE10PBT with alternatives