M29DW324DT70N1F vs M29DW323DT70N1F feature comparison

M29DW324DT70N1F Numonyx Memory Solutions

Buy Now Datasheet

M29DW323DT70N1F Micron Technology Inc

Buy Now Datasheet
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NUMONYX MICRON TECHNOLOGY INC
Part Package Code TSOP
Package Description 12 X 20 MM, LEAD FREE, PLASTIC, TSOP-48 TSOP-48
Pin Count 48
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 70 ns 70 ns
Additional Feature TOP BOOT BLOCK
Alternate Memory Width 8 8
Boot Block TOP
JESD-30 Code R-PDSO-G48 R-PDSO-G48
JESD-609 Code e3/e6
Length 18.4 mm 18.4 mm
Memory Density 33554432 bit 33554432 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 48 48
Number of Words 2097152 words 2097152 words
Number of Words Code 2000000 2000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 2MX16 2MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSOP1 TSOP1
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260
Programming Voltage 3 V 3 V
Qualification Status Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN/TIN BISMUTH
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Type NOR TYPE
Width 12 mm 12 mm
Base Number Matches 2 3
Date Of Intro 2018-01-25

Compare M29DW324DT70N1F with alternatives