M29DW324DB70ZA6T vs M29DW324DT70ZA6 feature comparison

M29DW324DB70ZA6T Numonyx Memory Solutions

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M29DW324DT70ZA6 Numonyx Memory Solutions

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NUMONYX NUMONYX
Part Package Code BGA BGA
Package Description TFBGA, TFBGA,
Pin Count 63 63
Reach Compliance Code not_compliant not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 70 ns 70 ns
Additional Feature BOTTOM BOOT BLOCK TOP BOOT BLOCK
Alternate Memory Width 8 8
Boot Block BOTTOM TOP
JESD-30 Code R-PBGA-B63 R-PBGA-B63
JESD-609 Code e0 e0
Length 11 mm 11 mm
Memory Density 33554432 bit 33554432 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 63 63
Number of Words 2097152 words 2097152 words
Number of Words Code 2000000 2000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 2MX16 2MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA TFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 3 V 3 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin/Lead (Sn63Pb37) Tin/Lead (Sn63Pb37)
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Type NOR TYPE NOR TYPE
Width 7 mm 7 mm
Base Number Matches 2 2

Compare M29DW324DB70ZA6T with alternatives

Compare M29DW324DT70ZA6 with alternatives