Findchips: Compare M29DW324DB70ZA6 vs M29DW323DB70ZA6

M29DW324DB70ZA6 vs M29DW323DB70ZA6 feature comparison

Buy Now Datasheet

Buy Now Datasheet

Rohs Code	No	No
Part Life Cycle Code	Obsolete	Obsolete
Ihs Manufacturer	NUMONYX	NUMONYX
Part Package Code	BGA	BGA
Package Description	TFBGA,	TFBGA,
Pin Count	63	63
Reach Compliance Code	not_compliant	not_compliant
ECCN Code	EAR99	EAR99
HTS Code	8542.32.00.51	8542.32.00.51
Access Time-Max	70 ns	70 ns
Additional Feature	BOTTOM BOOT BLOCK	BOTTOM BOOT BLOCK
Alternate Memory Width	8	8
Boot Block	BOTTOM	BOTTOM
JESD-30 Code	R-PBGA-B63	R-PBGA-B63
JESD-609 Code	e0	e0
Length	11 mm	11 mm
Memory Density	33554432 bit	33554432 bit
Memory IC Type	FLASH	FLASH
Memory Width	16	16
Number of Functions	1	1
Number of Terminals	63	63
Number of Words	2097152 words	2097152 words
Number of Words Code	2000000	2000000
Operating Mode	ASYNCHRONOUS	ASYNCHRONOUS
Operating Temperature-Max	85 °C	85 °C
Operating Temperature-Min	-40 °C	-40 °C
Organization	2MX16	2MX16
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	TFBGA	TFBGA
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial	PARALLEL	PARALLEL
Programming Voltage	3 V	3 V
Qualification Status	Not Qualified	Not Qualified
Seated Height-Max	1.2 mm	1.2 mm
Supply Voltage-Max (Vsup)	3.6 V	3.6 V
Supply Voltage-Min (Vsup)	2.7 V	2.7 V
Supply Voltage-Nom (Vsup)	3 V	3 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	INDUSTRIAL	INDUSTRIAL
Terminal Finish	Tin/Lead (Sn63Pb37)	Tin/Lead (Sn63Pb37)
Terminal Form	BALL	BALL
Terminal Pitch	0.8 mm	0.8 mm
Terminal Position	BOTTOM	BOTTOM
Type	NOR TYPE	NOR TYPE
Width	7 mm	7 mm
Base Number Matches	2	2
	Memory » Flash Memories	Memory » Flash Memories