M29DW323DB70ZE1E
vs
M29DW324DT70ZE6
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
MICRON TECHNOLOGY INC
MICRON TECHNOLOGY INC
Package Description
TFBGA,
FBGA, BGA48,6X8,32
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Date Of Intro
2018-01-25
Access Time-Max
70 ns
70 ns
Alternate Memory Width
8
8
JESD-30 Code
R-PBGA-B48
R-PBGA-B48
Length
8 mm
Memory Density
33554432 bit
33554432 bit
Memory IC Type
FLASH
FLASH
Memory Width
16
16
Number of Functions
1
Number of Terminals
48
48
Number of Words
2097152 words
2097152 words
Number of Words Code
2000000
2000000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
2MX16
2MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
FBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
GRID ARRAY, FINE PITCH
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
3 V
Seated Height-Max
1.2 mm
Supply Voltage-Max (Vsup)
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
Supply Voltage-Nom (Vsup)
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Width
6 mm
Base Number Matches
3
3
Rohs Code
Boot Block
TOP
Command User Interface
YES
Common Flash Interface
YES
Data Polling
YES
Number of Sectors/Size
8,63
Package Equivalence Code
BGA48,6X8,32
Qualification Status
Not Qualified
Ready/Busy
YES
Sector Size
8K,64K
Standby Current-Max
0.0001 A
Supply Current-Max
0.02 mA
Toggle Bit
YES
Type
NOR TYPE