M29DW128F60ZA6F
vs
M29DW128F60ZA1E
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MICRON TECHNOLOGY INC
|
STMICROELECTRONICS
|
| Package Description |
BGA, BGA64,8X8,40
|
10 X 13 MM, 1 MM PITCH, LEAD FREE, PLASTIC, TBGA-64
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Access Time-Max |
60 ns
|
60 ns
|
| Alternate Memory Width |
8
|
8
|
| Boot Block |
BOTTOM/TOP
|
BOTTOM/TOP
|
| Command User Interface |
YES
|
YES
|
| Common Flash Interface |
YES
|
YES
|
| Data Polling |
YES
|
YES
|
| JESD-30 Code |
S-PBGA-B64
|
R-PBGA-B64
|
| Memory Density |
134217728 bit
|
134217728 bit
|
| Memory IC Type |
FLASH
|
FLASH
|
| Memory Width |
16
|
16
|
| Number of Sectors/Size |
16,254
|
16,254
|
| Number of Terminals |
64
|
64
|
| Number of Words |
8388608 words
|
8388608 words
|
| Number of Words Code |
8000000
|
8000000
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Organization |
8MX16
|
8MX16
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
TBGA
|
| Package Equivalence Code |
BGA64,8X8,40
|
BGA64,8X8,32
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
GRID ARRAY
|
GRID ARRAY, THIN PROFILE
|
| Page Size |
8/16 words
|
8/16 words
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Ready/Busy |
YES
|
YES
|
| Sector Size |
8K,64K
|
8K,64K
|
| Standby Current-Max |
0.0001 A
|
0.0001 A
|
| Supply Current-Max |
0.02 mA
|
0.02 mA
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Toggle Bit |
YES
|
YES
|
| Type |
NOR TYPE
|
NOR TYPE
|
| Base Number Matches |
3
|
3
|
| Part Package Code |
|
BGA
|
| Pin Count |
|
64
|
| Additional Feature |
|
100,000 PROGRAM/ERASE CYCLES
|
| Length |
|
13 mm
|
| Number of Functions |
|
1
|
| Operating Mode |
|
ASYNCHRONOUS
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Programming Voltage |
|
3 V
|
| Seated Height-Max |
|
1.2 mm
|
| Supply Voltage-Max (Vsup) |
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
|
2.7 V
|
| Supply Voltage-Nom (Vsup) |
|
3 V
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
| Width |
|
10 mm
|
|
|
|
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