M28W640FCB70ZB1 vs MX29LV640EBXEI-70G feature comparison

M28W640FCB70ZB1 STMicroelectronics

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MX29LV640EBXEI-70G Macronix International Co Ltd

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Rohs Code No Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer STMICROELECTRONICS MACRONIX INTERNATIONAL CO LTD
Part Package Code BGA BGA
Package Description 6.39 X 10.50 MM, 0.75 PITCH, TFBGA-48 LFBGA,
Pin Count 48 48
Reach Compliance Code not_compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 70 ns 70 ns
Additional Feature BOTTOM BOOT BLOCK BOTTOM BOOT BLOCK
Boot Block BOTTOM BOTTOM
JESD-30 Code R-PBGA-B48 R-PBGA-B48
JESD-609 Code e0
Length 10.5 mm 8 mm
Memory Density 67108864 bit 67108864 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 48 48
Number of Words 4194304 words 4194304 words
Number of Words Code 4000000 4000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 4MX16 4MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA LFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 3 V 3 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.3 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 0.75 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Type NOR TYPE
Width 6.39 mm 6 mm
Base Number Matches 4 1
Factory Lead Time 12 Weeks
Alternate Memory Width 8
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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