M28W320C-ZBT vs WS57C256F-70T feature comparison

M28W320C-ZBT STMicroelectronics

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WS57C256F-70T Teledyne e2v

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Part Life Cycle Code Obsolete Active
Ihs Manufacturer STMICROELECTRONICS TELEDYNE E2V (UK) LTD
Part Package Code BGA DIP
Package Description TFBGA, 0.300 INCH, CERAMIC, DIP-28
Pin Count 47 28
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.61
JESD-30 Code R-PBGA-B47 R-CDIP-T28
Length 10.5 mm
Memory Density 33554432 bit 262144 bit
Memory IC Type FLASH UVPROM
Memory Width 16 8
Number of Functions 1 1
Number of Terminals 47 28
Number of Words 2097152 words 32768 words
Number of Words Code 2000000 32000
Operating Mode SYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 2MX16 32KX8
Package Body Material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
Package Code TFBGA DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY IN-LINE
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 3 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V 5.5 V
Supply Voltage-Min (Vsup) 2.7 V 4.5 V
Supply Voltage-Nom (Vsup) 3 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Form BALL THROUGH-HOLE
Terminal Pitch 0.75 mm
Terminal Position BOTTOM DUAL
Type NOR TYPE
Width 6.39 mm
Base Number Matches 1 3
Access Time-Max 70 ns
Supply Current-Max 0.025 mA

Compare M28W320C-ZBT with alternatives

Compare WS57C256F-70T with alternatives