M28W160ECB85ZB6S
vs
M28W160ECB85ZB6U
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
STMICROELECTRONICS
MICRON TECHNOLOGY INC
Part Package Code
BGA
Package Description
6.39 X 6.37 MM, 0.75 MM PITCH, TFBGA-46
FBGA, BGA46,6X8,30
Pin Count
46
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
85 ns
85 ns
Boot Block
BOTTOM
BOTTOM
Command User Interface
YES
YES
Common Flash Interface
YES
YES
Data Polling
NO
NO
JESD-30 Code
R-PBGA-B46
R-PBGA-B46
JESD-609 Code
e1
Length
6.39 mm
Memory Density
16777216 bit
16777216 bit
Memory IC Type
FLASH
FLASH
Memory Width
16
16
Number of Functions
1
Number of Sectors/Size
8,31
8,31
Number of Terminals
46
46
Number of Words
1048576 words
1048576 words
Number of Words Code
1000000
1000000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
1MX16
1MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
FBGA
Package Equivalence Code
BGA46,6X8,30
BGA46,6X8,30
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
GRID ARRAY, FINE PITCH
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
3 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
Sector Size
4K,32K
4K,32K
Standby Current-Max
0.000005 A
0.000005 A
Supply Current-Max
0.02 mA
0.02 mA
Supply Voltage-Max (Vsup)
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
Supply Voltage-Nom (Vsup)
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
0.75 mm
0.75 mm
Terminal Position
BOTTOM
BOTTOM
Toggle Bit
NO
NO
Type
NOR TYPE
NOR TYPE
Width
6.37 mm
Base Number Matches
3
3
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