M28W160CB85ZB1
vs
M28W160ECB85ZB1E
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
STMICROELECTRONICS
STMICROELECTRONICS
Part Package Code
BGA
BGA
Package Description
6.39 X 6.37 MM, 0.75 MM PITCH, TFBGA-46
6.39 X 6.37 MM, 0.75MM PITCH, TFBGA-46
Pin Count
46
46
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
85 ns
85 ns
Additional Feature
BOTTOM BOOT BLOCK
Boot Block
BOTTOM
BOTTOM
JESD-30 Code
R-PBGA-B46
R-PBGA-B46
JESD-609 Code
e1
e1
Length
6.39 mm
6.39 mm
Memory Density
16777216 bit
16777216 bit
Memory IC Type
FLASH
FLASH
Memory Width
16
16
Number of Functions
1
1
Number of Terminals
46
46
Number of Words
1048576 words
1048576 words
Number of Words Code
1000000
1000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
1MX16
1MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
TFBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
3 V
3 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1.2 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN SILVER COPPER
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
0.75 mm
0.75 mm
Terminal Position
BOTTOM
BOTTOM
Type
NOR TYPE
NOR TYPE
Width
6.37 mm
6.37 mm
Base Number Matches
2
2
Compare M28W160CB85ZB1 with alternatives
Compare M28W160ECB85ZB1E with alternatives