M28R400CB90ZB6T
vs
M28R400CT90ZB1U
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
STMICROELECTRONICS
STMICROELECTRONICS
Part Package Code
BGA
BGA
Package Description
6.39 X 6.37 MM, 0.75 MM PITCH, TFBGA-46
6.39 X 6.37 MM, 0.75 MM PITCH, TFBGA-46
Pin Count
46
46
Reach Compliance Code
not_compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
90 ns
90 ns
Additional Feature
BOTTOM BOOT BLOCK
TOP BOOT BLOCK
Boot Block
BOTTOM
TOP
Command User Interface
YES
Common Flash Interface
YES
Data Polling
NO
JESD-30 Code
R-PBGA-B46
R-PBGA-B46
JESD-609 Code
e0
e1
Length
6.39 mm
6.39 mm
Memory Density
4194304 bit
4194304 bit
Memory IC Type
FLASH
FLASH
Memory Width
16
16
Number of Functions
1
1
Number of Sectors/Size
8,7
Number of Terminals
46
46
Number of Words
262144 words
262144 words
Number of Words Code
256000
256000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
256KX16
256KX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
TFBGA
Package Equivalence Code
BGA46,6X8,30
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
1.8 V
1.8 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1.2 mm
Sector Size
4K,32K
Standby Current-Max
0.000005 A
Supply Current-Max
0.02 mA
Supply Voltage-Max (Vsup)
2 V
2 V
Supply Voltage-Min (Vsup)
1.7 V
1.7 V
Supply Voltage-Nom (Vsup)
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
TIN LEAD
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
0.75 mm
0.75 mm
Terminal Position
BOTTOM
BOTTOM
Toggle Bit
NO
Type
NOR TYPE
NOR TYPE
Width
6.37 mm
6.37 mm
Base Number Matches
2
2
Compare M28R400CB90ZB6T with alternatives
Compare M28R400CT90ZB1U with alternatives