M28F1001-15XF113
vs
AM28F010-150C3PEB
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
STMICROELECTRONICS
|
ADVANCED MICRO DEVICES INC
|
| Part Package Code |
DIP
|
DIP
|
| Package Description |
FRIT SEALED, CERAMIC, DIP-32
|
PLASTIC, DIP-32
|
| Pin Count |
32
|
32
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
3A001.A.2.C
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Access Time-Max |
150 ns
|
150 ns
|
| Additional Feature |
1000 ERASE/PROGRAM CYCLES
|
|
| JESD-30 Code |
R-GDIP-T32
|
R-PDIP-T32
|
| Length |
41.885 mm
|
42.164 mm
|
| Memory Density |
1048576 bit
|
1048576 bit
|
| Memory IC Type |
FLASH
|
FLASH
|
| Memory Width |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
32
|
32
|
| Number of Words |
131072 words
|
131072 words
|
| Number of Words Code |
128000
|
128000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Organization |
128KX8
|
128KX8
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
PLASTIC/EPOXY
|
| Package Code |
WDIP
|
DIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE, WINDOW
|
IN-LINE
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Programming Voltage |
12 V
|
12 V
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
5.72 mm
|
5.715 mm
|
| Supply Voltage-Max (Vsup) |
5.25 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.75 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
MILITARY
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Type |
NOR TYPE
|
|
| Width |
15.24 mm
|
15.24 mm
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare M28F1001-15XF113 with alternatives
Compare AM28F010-150C3PEB with alternatives