M28F1001-12XF314
vs
AM27F010-125DI
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
STMICROELECTRONICS
ADVANCED MICRO DEVICES INC
Part Package Code
DIP
DIP
Package Description
FRIT SEALED, CERAMIC, DIP-32
0.600 INCH, DIP-32
Pin Count
32
32
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
120 ns
120 ns
Additional Feature
10000 ERASE/PROGRAM CYCLES
JESD-30 Code
R-GDIP-T32
R-GDIP-T32
Length
41.885 mm
42.1005 mm
Memory Density
1048576 bit
1048576 bit
Memory IC Type
FLASH
FLASH
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
32
32
Number of Words
131072 words
131072 words
Number of Words Code
128000
128000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
128KX8
128KX8
Output Characteristics
3-STATE
3-STATE
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
WDIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE, WINDOW
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
12 V
12 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.72 mm
5.588 mm
Supply Voltage-Max (Vsup)
5.25 V
5.25 V
Supply Voltage-Min (Vsup)
4.75 V
4.75 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
INDUSTRIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Type
NOR TYPE
NOR TYPE
Width
15.24 mm
15.24 mm
Base Number Matches
1
1
Compare M28F1001-12XF314 with alternatives
Compare AM27F010-125DI with alternatives