M27V512-200B1 vs M27V101-250L6 feature comparison

M27V512-200B1 STMicroelectronics

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M27V101-250L6 STMicroelectronics

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer STMICROELECTRONICS STMICROELECTRONICS
Part Package Code DIP QFJ
Package Description DIP, DIP28,.6 WQCCN, LCC32,.45X.55
Pin Count 28 32
Reach Compliance Code not_compliant not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.61
Access Time-Max 200 ns 250 ns
I/O Type COMMON COMMON
JESD-30 Code R-PDIP-T28 R-CQCC-N32
JESD-609 Code e0 e0
Length 37.085 mm 13.97 mm
Memory Density 524288 bit 1048576 bit
Memory IC Type OTP ROM UVPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 28 32
Number of Words 65536 words 131072 words
Number of Words Code 64000 128000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 64KX8 128KX8
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
Package Code DIP WQCCN
Package Equivalence Code DIP28,.6 LCC32,.45X.55
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE CHIP CARRIER, WINDOW
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 2.28 mm
Standby Current-Max 0.00001 A 0.00002 A
Supply Current-Max 0.01 mA 0.03 mA
Supply Voltage-Max (Vsup) 3.6 V 5.5 V
Supply Voltage-Min (Vsup) 3 V 3.2 V
Supply Voltage-Nom (Vsup) 3.3 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE NO LEAD
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL QUAD
Width 15.24 mm 11.43 mm
Base Number Matches 1 1
Pbfree Code No

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