M27V256-150B1
vs
M27C256B-60C3X
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
STMICROELECTRONICS
STMICROELECTRONICS
Part Package Code
DIP
QFJ
Package Description
0.600 INCH, PLASTIC, DIP-28
PLASTIC, LCC-32
Pin Count
28
32
Reach Compliance Code
not_compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
150 ns
60 ns
I/O Type
COMMON
COMMON
JESD-30 Code
R-PDIP-T28
R-PQCC-J32
JESD-609 Code
e0
e3
Length
37.085 mm
13.995 mm
Memory Density
262144 bit
262144 bit
Memory IC Type
OTP ROM
OTP ROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
28
32
Number of Words
32768 words
32768 words
Number of Words Code
32000
32000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
125 °C
Operating Temperature-Min
-40 °C
Organization
32KX8
32KX8
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
QCCJ
Package Equivalence Code
DIP28,.6
LDCC32,.5X.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
CHIP CARRIER
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
12.75 V
12.75 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
3.56 mm
Standby Current-Max
0.00001 A
0.0001 A
Supply Current-Max
0.01 mA
0.03 mA
Supply Voltage-Max (Vsup)
3.6 V
5.5 V
Supply Voltage-Min (Vsup)
3 V
4.5 V
Supply Voltage-Nom (Vsup)
3.3 V
5 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
AUTOMOTIVE
Terminal Finish
TIN LEAD
MATTE TIN
Terminal Form
THROUGH-HOLE
J BEND
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
DUAL
QUAD
Width
15.24 mm
11.455 mm
Base Number Matches
1
1
Compare M27V256-150B1 with alternatives
Compare M27C256B-60C3X with alternatives