M27C801-80F1TR
vs
AT27LV080-30PI
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
STMICROELECTRONICS
ATMEL CORP
Part Package Code
DIP
DIP
Package Description
CERAMIC, WINDOWED, FRIT SEALED, DIP-32
DIP, DIP32,.6
Pin Count
32
32
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.61
8542.32.00.71
Access Time-Max
80 ns
300 ns
JESD-30 Code
R-CDIP-T32
R-PDIP-T32
JESD-609 Code
e3
e0
Length
41.885 mm
42.05 mm
Memory Density
8388608 bit
8388608 bit
Memory IC Type
UVPROM
OTP ROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
32
32
Number of Words
1048576 words
1048576 words
Number of Words Code
1000000
1000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
1MX8
1MX8
Package Body Material
CERAMIC, METAL-SEALED COFIRED
PLASTIC/EPOXY
Package Code
WDIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE, WINDOW
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.72 mm
5.59 mm
Supply Current-Max
0.035 mA
0.04 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
3 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
TIN
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
15.24 mm
15.24 mm
Base Number Matches
1
1
Pbfree Code
I/O Type
COMMON
Output Characteristics
3-STATE
Package Equivalence Code
DIP32,.6
Standby Current-Max
0.00002 A
Compare M27C801-80F1TR with alternatives
Compare AT27LV080-30PI with alternatives