M27C801-60B1X vs M27V801-200F6 feature comparison

M27C801-60B1X STMicroelectronics

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M27V801-200F6 STMicroelectronics

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Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer STMICROELECTRONICS STMICROELECTRONICS
Part Package Code DIP DIP
Package Description 0.600 INCH, PLASTIC, DIP-32 FRIT SEALED, WINDOWED, CERAMIC, DIP-32
Pin Count 32 32
Reach Compliance Code compliant not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.61
Access Time-Max 60 ns 200 ns
I/O Type COMMON COMMON
JESD-30 Code R-PDIP-T32 R-GDIP-T32
JESD-609 Code e3 e0
Length 41.91 mm 41.885 mm
Memory Density 8388608 bit 8388608 bit
Memory IC Type OTP ROM UVPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 1048576 words 1048576 words
Number of Words Code 1000000 1000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 1MX8 1MX8
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code DIP WDIP
Package Equivalence Code DIP32,.6 DIP32,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE, WINDOW
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 5.72 mm
Standby Current-Max 0.0001 A 0.00002 A
Supply Current-Max 0.035 mA 0.015 mA
Supply Voltage-Max (Vsup) 5.5 V 3.63 V
Supply Voltage-Min (Vsup) 4.5 V 2.97 V
Supply Voltage-Nom (Vsup) 5 V 3.3 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish MATTE TIN TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 15.24 mm 15.24 mm
Base Number Matches 1 1

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Compare M27V801-200F6 with alternatives