M27C800-90XF6
vs
AM27C800-200DCB
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
STMICROELECTRONICS
ADVANCED MICRO DEVICES INC
Part Package Code
DIP
DIP
Package Description
WINDOWED, FRIT SEALED, CERAMIC, DIP-42
WDIP, DIP42,.6
Pin Count
42
42
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.61
8542.32.00.61
Access Time-Max
90 ns
200 ns
Alternate Memory Width
8
8
I/O Type
COMMON
COMMON
JESD-30 Code
R-GDIP-T42
R-GDIP-T42
JESD-609 Code
e3
e0
Length
54.635 mm
54.864 mm
Memory Density
8388608 bit
8388608 bit
Memory IC Type
UVPROM
UVPROM
Memory Width
16
16
Number of Functions
1
1
Number of Terminals
42
42
Number of Words
524288 words
524288 words
Number of Words Code
512000
512000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
512KX16
512KX16
Output Characteristics
3-STATE
3-STATE
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
WDIP
WDIP
Package Equivalence Code
DIP42,.6
DIP42,.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE, WINDOW
IN-LINE, WINDOW
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.97 mm
5.588 mm
Standby Current-Max
0.00005 A
Supply Current-Max
0.07 mA
0.05 mA
Supply Voltage-Max (Vsup)
5.25 V
5.5 V
Supply Voltage-Min (Vsup)
4.75 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
MATTE TIN
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
15.24 mm
15.24 mm
Base Number Matches
1
1
Compare M27C800-90XF6 with alternatives
Compare AM27C800-200DCB with alternatives