M27C800-100XF1 vs AM27C800-200DCB feature comparison

M27C800-100XF1 STMicroelectronics

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AM27C800-200DCB AMD

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Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer STMICROELECTRONICS ADVANCED MICRO DEVICES INC
Part Package Code DIP DIP
Package Description WINDOWED, FRIT SEALED, CERAMIC, DIP-42 WDIP, DIP42,.6
Pin Count 42 42
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.61 8542.32.00.61
Access Time-Max 100 ns 200 ns
Alternate Memory Width 8 16
I/O Type COMMON COMMON
JESD-30 Code R-GDIP-T42 R-GDIP-T42
JESD-609 Code e3 e0
Length 54.635 mm 54.864 mm
Memory Density 8388608 bit 8388608 bit
Memory IC Type UVPROM UVPROM
Memory Width 16 8
Number of Functions 1 1
Number of Terminals 42 42
Number of Words 524288 words 1048576 words
Number of Words Code 512000 1000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 512KX16 1MX8
Output Characteristics 3-STATE 3-STATE
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code WDIP WDIP
Package Equivalence Code DIP42,.6 DIP42,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE, WINDOW IN-LINE, WINDOW
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.97 mm 5.588 mm
Standby Current-Max 0.00005 A
Supply Current-Max 0.07 mA 0.05 mA
Supply Voltage-Max (Vsup) 5.25 V 5.5 V
Supply Voltage-Min (Vsup) 4.75 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish MATTE TIN Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 15.24 mm 15.24 mm
Base Number Matches 1 1

Compare M27C800-100XF1 with alternatives

Compare AM27C800-200DCB with alternatives