M27C64A-30F6X
vs
MBM2764-30-XZ
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
STMICROELECTRONICS
FUJITSU SEMICONDUCTOR AMERICA INC
Part Package Code
DIP
Package Description
FRIT SEALED, WINDOWED, CERAMIC, DIP-28
WDIP,
Pin Count
28
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.61
8542.32.00.61
Access Time-Max
300 ns
300 ns
I/O Type
COMMON
JESD-30 Code
R-GDIP-T28
R-GDIP-T28
JESD-609 Code
e3
Length
36.92 mm
37.275 mm
Memory Density
65536 bit
65536 bit
Memory IC Type
UVPROM
UVPROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
28
28
Number of Words
8192 words
8192 words
Number of Words Code
8000
8000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
8KX8
8KX8
Output Characteristics
3-STATE
3-STATE
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
WDIP
WDIP
Package Equivalence Code
DIP28,.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE, WINDOW
IN-LINE, WINDOW
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
12.5 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.97 mm
5.84 mm
Standby Current-Max
0.0001 A
Supply Current-Max
0.03 mA
0.1 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
NMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
MATTE TIN
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
15.24 mm
15.24 mm
Base Number Matches
1
2
Compare M27C64A-30F6X with alternatives
Compare MBM2764-30-XZ with alternatives