M27C512-25XF3X
vs
M27C512-20XB3X
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
STMICROELECTRONICS
STMICROELECTRONICS
Part Package Code
DIP
DIP
Package Description
FRIT SEALED, WINDOWED, CERAMIC, DIP-28
0.600 INCH, PLASTIC, DIP-28
Pin Count
28
28
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.61
8542.32.00.71
Access Time-Max
150 ns
150 ns
I/O Type
COMMON
COMMON
JESD-30 Code
R-GDIP-T28
R-PDIP-T28
Length
36.92 mm
37.085 mm
Memory Density
524288 bit
524288 bit
Memory IC Type
UVPROM
OTP ROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
28
28
Number of Words
65536 words
65536 words
Number of Words Code
64000
64000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
64KX8
64KX8
Output Characteristics
3-STATE
3-STATE
Package Body Material
CERAMIC, GLASS-SEALED
PLASTIC/EPOXY
Package Code
WDIP
DIP
Package Equivalence Code
DIP28,.6
DIP28,.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE, WINDOW
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.97 mm
5.08 mm
Standby Current-Max
0.0001 A
0.0001 A
Supply Current-Max
0.03 mA
0.03 mA
Supply Voltage-Max (Vsup)
5.25 V
5.25 V
Supply Voltage-Min (Vsup)
4.75 V
4.75 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
NOT SPECIFIED
Width
15.24 mm
15.24 mm
Base Number Matches
1
1
Compare M27C512-25XF3X with alternatives
Compare M27C512-20XB3X with alternatives