M27C512-20F3
vs
AM27C512L-200DEB
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
STMICROELECTRONICS
ADVANCED MICRO DEVICES INC
Part Package Code
DIP
DIP
Package Description
CERAMIC, DIP-28
WDIP, DIP28,.6
Pin Count
28
28
Reach Compliance Code
not_compliant
unknown
ECCN Code
EAR99
3A001.A.2.C
HTS Code
8542.32.00.61
8542.32.00.61
Access Time-Max
200 ns
200 ns
I/O Type
COMMON
COMMON
JESD-30 Code
R-GDIP-T28
R-GDIP-T28
JESD-609 Code
e0
e0
Length
36.92 mm
37.1475 mm
Memory Density
524288 bit
524288 bit
Memory IC Type
UVPROM
UVPROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
28
28
Number of Words
65536 words
65536 words
Number of Words Code
64000
64000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Organization
64KX8
64KX8
Output Characteristics
3-STATE
3-STATE
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
WDIP
WDIP
Package Equivalence Code
DIP28,.6
DIP28,.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE, WINDOW
IN-LINE, WINDOW
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.72 mm
5.588 mm
Standby Current-Max
0.0001 A
0.00004 A
Supply Current-Max
0.03 mA
0.025 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
MILITARY
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
15.24 mm
15.24 mm
Base Number Matches
1
1
Pbfree Code
Compare M27C512-20F3 with alternatives
Compare AM27C512L-200DEB with alternatives