M27C4002-20XB6TR
vs
M27C4002-20XF6TR
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
STMICROELECTRONICS
STMICROELECTRONICS
Part Package Code
DIP
DIP
Package Description
DIP,
DIP,
Pin Count
40
40
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.61
8542.32.00.61
Access Time-Max
200 ns
200 ns
Additional Feature
SEATED HGT-NOM
JESD-30 Code
R-PDIP-T40
R-CDIP-T40
Length
52.18 mm
52.195 mm
Memory Density
4194304 bit
4194304 bit
Memory IC Type
OTP ROM
UVPROM
Memory Width
16
16
Number of Functions
1
1
Number of Terminals
40
40
Number of Words
262144 words
262144 words
Number of Words Code
256000
256000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
256KX16
256KX16
Package Body Material
PLASTIC/EPOXY
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
DIP
Package Equivalence Code
DIP40,.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
5 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.45 mm
5.72 mm
Standby Current-Max
0.0001 A
Supply Current-Max
0.07 mA
0.07 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
15.24 mm
13.2 mm
Base Number Matches
1
1
Temperature Grade
INDUSTRIAL
Compare M27C4002-20XB6TR with alternatives
Compare M27C4002-20XF6TR with alternatives