M27C256B-25F1
vs
AM27C256-150DE
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
STMICROELECTRONICS
|
CYPRESS SEMICONDUCTOR CORP
|
| Part Package Code |
DIP
|
|
| Package Description |
0.280 INCH, LEAD FREE, CERAMIC, WINDOWED, FRIT SEALED, DIP-28
|
|
| Pin Count |
28
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.32.00.61
|
|
| Access Time-Max |
150 ns
|
|
| I/O Type |
COMMON
|
|
| JESD-30 Code |
R-CDIP-T28
|
|
| JESD-609 Code |
e3
|
|
| Length |
36.92 mm
|
|
| Memory Density |
262144 bit
|
|
| Memory IC Type |
UVPROM
|
|
| Memory Width |
8
|
|
| Number of Functions |
1
|
|
| Number of Terminals |
28
|
|
| Number of Words |
32768 words
|
|
| Number of Words Code |
32000
|
|
| Operating Mode |
ASYNCHRONOUS
|
|
| Operating Temperature-Max |
70 °C
|
|
| Operating Temperature-Min |
|
|
| Organization |
32KX8
|
|
| Output Characteristics |
3-STATE
|
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
|
| Package Code |
WDIP
|
|
| Package Equivalence Code |
DIP28,.6
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
IN-LINE, WINDOW
|
|
| Parallel/Serial |
PARALLEL
|
|
| Programming Voltage |
12.75 V
|
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
5.72 mm
|
|
| Standby Current-Max |
0.0002 A
|
|
| Supply Current-Max |
0.03 mA
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
|
| Supply Voltage-Nom (Vsup) |
5 V
|
|
| Surface Mount |
NO
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
COMMERCIAL
|
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
THROUGH-HOLE
|
|
| Terminal Pitch |
2.54 mm
|
|
| Terminal Position |
DUAL
|
|
| Width |
15.24 mm
|
|
| Base Number Matches |
1
|
4
|
|
|
|
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