M27C256B-15XF1X
vs
M27C256B-15F7X
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
STMICROELECTRONICS
|
STMICROELECTRONICS
|
Part Package Code |
DIP
|
DIP
|
Package Description |
FRIT SEALED, WINDOWED, CERAMIC, DIP-28
|
WDIP,
|
Pin Count |
28
|
28
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.61
|
8542.32.00.61
|
Access Time-Max |
150 ns
|
150 ns
|
I/O Type |
COMMON
|
|
JESD-30 Code |
R-GDIP-T28
|
R-GDIP-T28
|
JESD-609 Code |
e3
|
|
Length |
36.92 mm
|
|
Memory Density |
262144 bit
|
262144 bit
|
Memory IC Type |
UVPROM
|
UVPROM
|
Memory Width |
8
|
8
|
Number of Functions |
1
|
1
|
Number of Terminals |
28
|
28
|
Number of Words |
32768 words
|
32768 words
|
Number of Words Code |
32000
|
32000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
70 °C
|
105 °C
|
Operating Temperature-Min |
|
-40 °C
|
Organization |
32KX8
|
32KX8
|
Output Characteristics |
3-STATE
|
|
Package Body Material |
CERAMIC, GLASS-SEALED
|
CERAMIC, GLASS-SEALED
|
Package Code |
WDIP
|
WDIP
|
Package Equivalence Code |
DIP28,.6
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE, WINDOW
|
IN-LINE, WINDOW
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Programming Voltage |
12.75 V
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
5.97 mm
|
5.71 mm
|
Standby Current-Max |
0.0001 A
|
|
Supply Current-Max |
0.03 mA
|
0.03 mA
|
Supply Voltage-Max (Vsup) |
5.25 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
4.75 V
|
4.5 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
NO
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
Terminal Finish |
MATTE TIN
|
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Pitch |
2.54 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
15.24 mm
|
15.24 mm
|
Base Number Matches |
1
|
1
|
|
|
|
Compare M27C256B-15XF1X with alternatives
Compare M27C256B-15F7X with alternatives