M27C256B-15F3X
vs
AM27C256-150DCB
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
STMICROELECTRONICS
CYPRESS SEMICONDUCTOR CORP
Part Package Code
DIP
Package Description
FRIT SEALED, WINDOWED, CERAMIC, DIP-28
Pin Count
28
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
HTS Code
8542.32.00.61
Access Time-Max
150 ns
I/O Type
COMMON
JESD-30 Code
R-GDIP-T28
JESD-609 Code
e3
Length
36.92 mm
Memory Density
262144 bit
Memory IC Type
UVPROM
Memory Width
8
Number of Functions
1
Number of Terminals
28
Number of Words
32768 words
Number of Words Code
32000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
125 °C
Operating Temperature-Min
-40 °C
Organization
32KX8
Output Characteristics
3-STATE
Package Body Material
CERAMIC, GLASS-SEALED
Package Code
WDIP
Package Equivalence Code
DIP28,.6
Package Shape
RECTANGULAR
Package Style
IN-LINE, WINDOW
Parallel/Serial
PARALLEL
Programming Voltage
12.75 V
Qualification Status
Not Qualified
Seated Height-Max
5.97 mm
Standby Current-Max
0.0001 A
Supply Current-Max
0.03 mA
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
NO
Technology
CMOS
Temperature Grade
AUTOMOTIVE
Terminal Finish
MATTE TIN
Terminal Form
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
Width
15.24 mm
Base Number Matches
1
4
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