M27C256B-12XF7X
vs
M27C256B-12XF1
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
STMICROELECTRONICS
STMICROELECTRONICS
Part Package Code
DIP
DIP
Package Description
WDIP,
0.280 INCH, LEAD FREE, CERAMIC, WINDOWED, FRIT SEALED, DIP-28
Pin Count
28
28
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.61
8542.32.00.61
Access Time-Max
120 ns
120 ns
JESD-30 Code
R-GDIP-T28
R-CDIP-T28
Memory Density
262144 bit
262144 bit
Memory IC Type
UVPROM
UVPROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
28
28
Number of Words
32768 words
32768 words
Number of Words Code
32000
32000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
105 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
32KX8
32KX8
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, METAL-SEALED COFIRED
Package Code
WDIP
WDIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE, WINDOW
IN-LINE, WINDOW
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.71 mm
5.72 mm
Supply Current-Max
0.03 mA
0.03 mA
Supply Voltage-Max (Vsup)
5.25 V
5.25 V
Supply Voltage-Min (Vsup)
4.75 V
4.75 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
15.24 mm
15.24 mm
Base Number Matches
1
1
Rohs Code
I/O Type
COMMON
JESD-609 Code
e3
Length
36.92 mm
Output Characteristics
3-STATE
Package Equivalence Code
DIP28,.6
Programming Voltage
12.75 V
Standby Current-Max
0.0002 A
Terminal Finish
MATTE TIN
Compare M27C256B-12XF7X with alternatives
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