M27C2001-25F1TR
vs
AM27C020-255DCB
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
STMICROELECTRONICS
CYPRESS SEMICONDUCTOR CORP
Part Package Code
DIP
Package Description
LEAD FREE, WINDOWED, FRIT SEALED, CERAMIC, DIP-32
Pin Count
32
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
HTS Code
8542.32.00.61
Access Time-Max
250 ns
JESD-30 Code
R-CDIP-T32
JESD-609 Code
e3
Length
41.885 mm
Memory Density
2097152 bit
Memory IC Type
UVPROM
Memory Width
8
Number of Functions
1
Number of Terminals
32
Number of Words
262144 words
Number of Words Code
256000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
70 °C
Operating Temperature-Min
Organization
256KX8
Output Characteristics
3-STATE
Package Body Material
CERAMIC, METAL-SEALED COFIRED
Package Code
WDIP
Package Shape
RECTANGULAR
Package Style
IN-LINE, WINDOW
Parallel/Serial
PARALLEL
Qualification Status
Not Qualified
Seated Height-Max
5.72 mm
Supply Current-Max
0.03 mA
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
NO
Technology
CMOS
Temperature Grade
COMMERCIAL
Terminal Finish
TIN
Terminal Form
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
Width
15.24 mm
Base Number Matches
1
3
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