M27C1001-15XF1L
vs
MSM271000-15AS
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
STMICROELECTRONICS
LAPIS SEMICONDUCTOR CO LTD
Part Package Code
DIP
Package Description
WDIP,
DIP, DIP32,.6
Pin Count
32
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.61
8542.32.00.61
Access Time-Max
150 ns
150 ns
JESD-30 Code
R-GDIP-T32
R-XDIP-T32
Length
41.885 mm
Memory Density
1048576 bit
1048576 bit
Memory IC Type
UVPROM
UVPROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
32
32
Number of Words
131072 words
131072 words
Number of Words Code
128000
128000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
128KX8
128KX8
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC
Package Code
WDIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE, WINDOW
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.97 mm
Supply Current-Max
0.03 mA
0.1 mA
Supply Voltage-Max (Vsup)
5.25 V
Supply Voltage-Min (Vsup)
4.75 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
MOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
15.24 mm
Base Number Matches
1
2
Rohs Code
I/O Type
COMMON
JESD-609 Code
e0
Output Characteristics
3-STATE
Package Equivalence Code
DIP32,.6
Terminal Finish
Tin/Lead (Sn/Pb)
Compare M27C1001-15XF1L with alternatives
Compare MSM271000-15AS with alternatives