M25PX64SVZM6G
vs
W25Q64FVSSIF
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NUMONYX
WINBOND ELECTRONICS CORP
Part Package Code
BGA
Package Description
TBGA, BGA24,5X5,40
SOIC-8
Pin Count
24
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Clock Frequency-Max (fCLK)
75 MHz
104 MHz
Endurance
100000 Write/Erase Cycles
JESD-30 Code
R-PBGA-B24
S-PDSO-G8
Length
8 mm
5.28 mm
Memory Density
67108864 bit
67108864 bit
Memory IC Type
FLASH
FLASH
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
24
8
Number of Words
8388608 words
8388608 words
Number of Words Code
8000000
8000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
8MX8
8MX8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TBGA
SOP
Package Equivalence Code
BGA24,5X5,40
SOP8,.3
Package Shape
RECTANGULAR
SQUARE
Package Style
GRID ARRAY
SMALL OUTLINE
Parallel/Serial
SERIAL
SERIAL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Programming Voltage
2.7 V
3 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
2.16 mm
Serial Bus Type
SPI
SPI
Standby Current-Max
0.00001 A
0.00005 A
Supply Current-Max
0.015 mA
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
3 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
BALL
GULL WING
Terminal Pitch
1 mm
1.27 mm
Terminal Position
BOTTOM
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Type
NOR TYPE
Width
6 mm
5.28 mm
Write Cycle Time-Max (tWC)
15 ms
Write Protection
HARDWARE/SOFTWARE
HARDWARE/SOFTWARE
Base Number Matches
2
1
Samacsys Manufacturer
Winbond
Alternate Memory Width
1
Data Retention Time-Min
20
Output Characteristics
3-STATE
Compare M25PX64SVZM6G with alternatives
Compare W25Q64FVSSIF with alternatives