M25PX64SVZM3EB vs M25PX64-VZM6TP feature comparison

M25PX64SVZM3EB Micron Technology Inc

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M25PX64-VZM6TP Micron Technology Inc

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICRON TECHNOLOGY INC MICRON TECHNOLOGY INC
Package Description 6 X 8 MM, ROHS COMPLIANT, TBGA-24 TBGA, BGA24,5X5,40
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Clock Frequency-Max (fCLK) 75 MHz 75 MHz
JESD-30 Code R-PBGA-B24 R-PBGA-B24
Length 8 mm 8 mm
Memory Density 67108864 bit 67108864 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 24 24
Number of Words 8388608 words 8388608 words
Number of Words Code 8000000 8000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 8MX8 8MX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TBGA TBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE GRID ARRAY
Parallel/Serial SERIAL SERIAL
Programming Voltage 2.7 V 2.7 V
Seated Height-Max 1.2 mm 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 6 mm 6 mm
Base Number Matches 1 2
Pbfree Code Yes
Part Package Code BGA
Pin Count 24
Endurance 100000 Write/Erase Cycles
JESD-609 Code e1
Package Equivalence Code BGA24,5X5,40
Qualification Status Not Qualified
Serial Bus Type SPI
Standby Current-Max 0.00001 A
Supply Current-Max 0.015 mA
Terminal Finish TIN SILVER COPPER
Type NOR TYPE
Write Cycle Time-Max (tWC) 15 ms
Write Protection HARDWARE/SOFTWARE

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