M25PX64SOVZM3T vs W25Q64FVZPIQ feature comparison

M25PX64SOVZM3T Micron Technology Inc

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W25Q64FVZPIQ Winbond Electronics Corp

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICRON TECHNOLOGY INC WINBOND ELECTRONICS CORP
Package Description 6 X 8 MM, ROHS COMPLIANT, TBGA-24 WSON-8
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Clock Frequency-Max (fCLK) 75 MHz 104 MHz
JESD-30 Code R-PBGA-B24 R-PDSO-N8
Length 8 mm 6 mm
Memory Density 67108864 bit 67108864 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 24 8
Number of Words 8388608 words 8388608 words
Number of Words Code 8000000 8000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 8MX8 8MX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TBGA HSON
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE SMALL OUTLINE, HEAT SINK/SLUG
Parallel/Serial SERIAL SERIAL
Programming Voltage 2.7 V 3 V
Seated Height-Max 1.2 mm 0.8 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 3 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Form BALL NO LEAD
Terminal Pitch 1 mm 1.27 mm
Terminal Position BOTTOM DUAL
Width 6 mm 5 mm
Base Number Matches 6 1
Alternate Memory Width 1
Data Retention Time-Min 20
Output Characteristics 3-STATE
Package Equivalence Code SOLCC8,.2
Qualification Status Not Qualified
Serial Bus Type SPI
Standby Current-Max 0.00005 A
Write Protection HARDWARE/SOFTWARE

Compare M25PX64SOVZM3T with alternatives

Compare W25Q64FVZPIQ with alternatives