M25PX64-VZM6TG
vs
M25PX64SVZM6TG
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MICRON TECHNOLOGY INC
NUMONYX
Package Description
BGA, BGA24,5X5,40
TBGA, BGA24,5X5,40
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Clock Frequency-Max (fCLK)
75 MHz
75 MHz
Endurance
100000 Write/Erase Cycles
100000 Write/Erase Cycles
JESD-30 Code
S-PBGA-B24
R-PBGA-B24
Memory Density
67108864 bit
67108864 bit
Memory IC Type
FLASH
FLASH
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
24
24
Number of Words
8388608 words
8388608 words
Number of Words Code
8000000
8000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
8MX8
8MX8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
TBGA
Package Equivalence Code
BGA24,5X5,40
BGA24,5X5,40
Package Shape
SQUARE
RECTANGULAR
Package Style
GRID ARRAY
GRID ARRAY
Parallel/Serial
SERIAL
SERIAL
Qualification Status
Not Qualified
Not Qualified
Serial Bus Type
SPI
SPI
Standby Current-Max
0.00001 A
0.00001 A
Supply Current-Max
0.015 mA
0.015 mA
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Type
NOR TYPE
NOR TYPE
Write Protection
HARDWARE/SOFTWARE
HARDWARE/SOFTWARE
Base Number Matches
2
2
Pbfree Code
Part Package Code
BGA
Pin Count
24
Length
8 mm
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Programming Voltage
2.7 V
Seated Height-Max
1.2 mm
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
6 mm
Write Cycle Time-Max (tWC)
15 ms
Compare M25PX64-VZM6TG with alternatives
Compare M25PX64SVZM6TG with alternatives