M25PE10-VMP6G
vs
W25Q80BVSSAG
feature comparison
All Stats
Differences Only
Pbfree Code
Yes
Rohs Code
Yes
Yes
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MICRON TECHNOLOGY INC
WINBOND ELECTRONICS CORP
Part Package Code
SOIC
SOIC
Package Description
VSON, SOLCC8,.25
0.208 INCH, GREEN, PLASTIC, SOIC-8
Pin Count
8
8
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Clock Frequency-Max (fCLK)
75 MHz
80 MHz
Data Retention Time-Min
20
20
Endurance
100000 Write/Erase Cycles
100000 Write/Erase Cycles
JESD-30 Code
R-XDSO-N8
S-PDSO-G8
Length
6 mm
5.28 mm
Memory Density
1048576 bit
8388608 bit
Memory IC Type
FLASH
FLASH
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
8
8
Number of Words
131072 words
1048576 words
Number of Words Code
128000
1000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
105 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
128KX8
1MX8
Package Body Material
UNSPECIFIED
PLASTIC/EPOXY
Package Code
VSON
SOP
Package Equivalence Code
SOLCC8,.25
SOP8,.3
Package Shape
RECTANGULAR
SQUARE
Package Style
SMALL OUTLINE, VERY THIN PROFILE
SMALL OUTLINE
Parallel/Serial
SERIAL
SERIAL
Peak Reflow Temperature (Cel)
260
Programming Voltage
2.7 V
3 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1 mm
2.16 mm
Serial Bus Type
SPI
SPI
Standby Current-Max
0.00001 A
0.000005 A
Supply Current-Max
0.015 mA
0.018 mA
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
NO LEAD
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Type
NOR TYPE
NOR TYPE
Width
5 mm
5.28 mm
Write Protection
HARDWARE/SOFTWARE
HARDWARE/SOFTWARE
Base Number Matches
3
1
Output Characteristics
3-STATE
Compare M25PE10-VMP6G with alternatives
Compare W25Q80BVSSAG with alternatives