M25P80SVMN6TP
vs
LE25FW806MA
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MICRON TECHNOLOGY INC
SANYO SEMICONDUCTOR CO LTD
Part Package Code
SOIC
SOIC
Package Description
SOP,
0.225 INCH, MFP-8
Pin Count
8
8
Reach Compliance Code
compliant
unknown
Clock Frequency-Max (fCLK)
25 MHz
30 MHz
JESD-30 Code
R-PDSO-G8
R-PDSO-G8
Length
4.9 mm
5 mm
Memory Density
8388608 bit
8388608 bit
Memory IC Type
FLASH
FLASH
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
8
8
Number of Words
1048576 words
1048576 words
Number of Words Code
1000000
1000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
1MX8
1MX8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
LSOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE, LOW PROFILE
Parallel/Serial
SERIAL
SERIAL
Peak Reflow Temperature (Cel)
260
Programming Voltage
2.7 V
3 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.75 mm
1.7 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Width
3.9 mm
4.4 mm
Base Number Matches
2
3
ECCN Code
EAR99
HTS Code
8542.32.00.51
Technology
CMOS
Type
NOR TYPE
Compare M25P80SVMN6TP with alternatives
Compare LE25FW806MA with alternatives