M25P64-VME6TGBA
vs
M25PX64-VME3EB
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MICRON TECHNOLOGY INC
|
MICRON TECHNOLOGY INC
|
| Part Package Code |
DFP
|
|
| Package Description |
SON, SOLCC8,.3
|
|
| Pin Count |
8
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Clock Frequency-Max (fCLK) |
75 MHz
|
|
| Data Retention Time-Min |
20
|
|
| Endurance |
100000 Write/Erase Cycles
|
|
| JESD-30 Code |
R-PDSO-N8
|
|
| Length |
10.3 mm
|
|
| Memory Density |
67108864 bit
|
|
| Memory IC Type |
FLASH
|
FLASH
|
| Memory Width |
8
|
|
| Number of Functions |
1
|
|
| Number of Terminals |
8
|
|
| Number of Words |
8388608 words
|
|
| Number of Words Code |
8000000
|
|
| Operating Mode |
SYNCHRONOUS
|
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Organization |
8MX8
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
SON
|
|
| Package Equivalence Code |
SOLCC8,.3
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
SMALL OUTLINE
|
|
| Parallel/Serial |
PARALLEL
|
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Programming Voltage |
2.7 V
|
2.7 V
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
2.65 mm
|
|
| Serial Bus Type |
SPI
|
|
| Standby Current-Max |
0.0001 A
|
|
| Supply Current-Max |
0.02 mA
|
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
|
| Supply Voltage-Min (Vsup) |
2.7 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Form |
NO LEAD
|
|
| Terminal Pitch |
1.27 mm
|
|
| Terminal Position |
DUAL
|
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Type |
NOR TYPE
|
|
| Width |
7.5 mm
|
|
| Write Protection |
HARDWARE/SOFTWARE
|
|
| Base Number Matches |
2
|
1
|
|
|
|
Compare M25P64-VME6TGBA with alternatives
Compare M25PX64-VME3EB with alternatives