M25P64-VME6GBA
vs
M25PX64-VME6EA
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MICRON TECHNOLOGY INC
MICRON TECHNOLOGY INC
Part Package Code
DFP
Package Description
SON, SOLCC8,.3
Pin Count
8
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Clock Frequency-Max (fCLK)
75 MHz
Data Retention Time-Min
20
Endurance
100000 Write/Erase Cycles
JESD-30 Code
R-PDSO-N8
Length
10.3 mm
Memory Density
67108864 bit
Memory IC Type
FLASH
FLASH
Memory Width
8
Number of Functions
1
Number of Terminals
8
Number of Words
8388608 words
Number of Words Code
8000000
Operating Mode
SYNCHRONOUS
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Organization
8MX8
Package Body Material
PLASTIC/EPOXY
Package Code
SON
Package Equivalence Code
SOLCC8,.3
Package Shape
RECTANGULAR
Package Style
SMALL OUTLINE
Parallel/Serial
PARALLEL
Peak Reflow Temperature (Cel)
260
Programming Voltage
2.7 V
2.7 V
Qualification Status
Not Qualified
Seated Height-Max
2.65 mm
Serial Bus Type
SPI
Standby Current-Max
0.0001 A
Supply Current-Max
0.02 mA
Supply Voltage-Max (Vsup)
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
INDUSTRIAL
Terminal Form
NO LEAD
Terminal Pitch
1.27 mm
Terminal Position
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Type
NOR TYPE
Width
7.5 mm
Write Protection
HARDWARE/SOFTWARE
Base Number Matches
2
1
Compare M25P64-VME6GBA with alternatives
Compare M25PX64-VME6EA with alternatives