M25P40SVMP6TP/X
vs
W25Q80BVZPJG
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
MICRON TECHNOLOGY INC
WINBOND ELECTRONICS CORP
Package Description
SON, SOLCC8,.25
HVSON,
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Clock Frequency-Max (fCLK)
50 MHz
104 MHz
Data Retention Time-Min
20
Endurance
100000 Write/Erase Cycles
JESD-30 Code
R-PDSO-N8
R-PDSO-N8
Memory Density
4194304 bit
8388608 bit
Memory IC Type
FLASH
FLASH
Memory Width
8
8
Number of Terminals
8
8
Number of Words
524288 words
1048576 words
Number of Words Code
512000
1000000
Operating Temperature-Max
85 °C
105 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
512KX8
1MX8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SON
HVSON
Package Equivalence Code
SOLCC8,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Parallel/Serial
SERIAL
SERIAL
Qualification Status
Not Qualified
Serial Bus Type
SPI
Standby Current-Max
0.00001 A
Supply Current-Max
0.015 mA
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
NO LEAD
NO LEAD
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Type
NOR TYPE
Write Protection
HARDWARE/SOFTWARE
Base Number Matches
2
1
Length
6 mm
Number of Functions
1
Operating Mode
SYNCHRONOUS
Output Characteristics
3-STATE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Programming Voltage
3 V
Screening Level
AEC-Q100
Seated Height-Max
0.8 mm
Supply Voltage-Max (Vsup)
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
Supply Voltage-Nom (Vsup)
3 V
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
5 mm
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