M25P40-VMC6G/4A vs XC17128LPD8C feature comparison

M25P40-VMC6G/4A Micron Technology Inc

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XC17128LPD8C AMD Xilinx

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICRON TECHNOLOGY INC XILINX INC
Package Description HVSON, DIP, DIP8,.3
Reach Compliance Code unknown not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Clock Frequency-Max (fCLK) 75 MHz 10 MHz
JESD-30 Code R-PDSO-N8 R-PDIP-T8
Length 4 mm 9.3599 mm
Memory Density 4194304 bit 131072 bit
Memory IC Type FLASH CONFIGURATION MEMORY
Memory Width 8 1
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 524288 words 131072 words
Number of Words Code 512000 128000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 512KX8 128KX1
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HVSON DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE IN-LINE
Parallel/Serial SERIAL SERIAL
Programming Voltage 2.7 V
Seated Height-Max 0.6 mm 4.5974 mm
Supply Voltage-Max (Vsup) 3.6 V 5.25 V
Supply Voltage-Min (Vsup) 2.7 V 4.75 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Form NO LEAD THROUGH-HOLE
Terminal Pitch 0.8 mm 2.54 mm
Terminal Position DUAL DUAL
Type NOR TYPE
Width 3 mm 7.62 mm
Base Number Matches 1 1
Rohs Code No
Part Package Code DIP
Pin Count 8
I/O Type COMMON
JESD-609 Code e0
Moisture Sensitivity Level 1
Output Characteristics 3-STATE
Package Equivalence Code DIP8,.3
Peak Reflow Temperature (Cel) 225
Qualification Status Not Qualified
Standby Current-Max 0.00005 A
Supply Current-Max 0.005 mA
Supply Voltage-Nom (Vsup) 5 V
Terminal Finish TIN LEAD
Time@Peak Reflow Temperature-Max (s) 30

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