M25P16SVMP6P
vs
W25Q16BVDAIG
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MICRON TECHNOLOGY INC
WINBOND ELECTRONICS CORP
Package Description
SON, SOLCC8,.25
DIP-8
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Clock Frequency-Max (fCLK)
25 MHz
80 MHz
Data Retention Time-Min
20
20
Endurance
100000 Write/Erase Cycles
100000 Write/Erase Cycles
JESD-30 Code
R-PDSO-N8
R-PDIP-T8
Memory Density
16777216 bit
16777216 bit
Memory IC Type
FLASH
FLASH
Memory Width
8
8
Number of Terminals
8
8
Number of Words
2097152 words
2097152 words
Number of Words Code
2000000
2000000
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
2MX8
2MX8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SON
DIP
Package Equivalence Code
SOLCC8,.25
DIP8,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
IN-LINE
Parallel/Serial
SERIAL
SERIAL
Qualification Status
Not Qualified
Not Qualified
Serial Bus Type
SPI
SPI
Standby Current-Max
0.00001 A
0.000005 A
Supply Current-Max
0.015 mA
0.018 mA
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
NO LEAD
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
DUAL
DUAL
Type
NOR TYPE
NOR TYPE
Write Protection
HARDWARE/SOFTWARE
HARDWARE/SOFTWARE
Base Number Matches
2
1
Part Package Code
DIP
Pin Count
8
Length
9.27 mm
Number of Functions
1
Operating Mode
SYNCHRONOUS
Output Characteristics
3-STATE
Programming Voltage
3 V
Seated Height-Max
5.33 mm
Supply Voltage-Max (Vsup)
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
Supply Voltage-Nom (Vsup)
3 V
Width
7.62 mm
Compare W25Q16BVDAIG with alternatives