M25P16SVMP6P
vs
W25Q16BVDAIG
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NUMONYX
WINBOND ELECTRONICS CORP
Part Package Code
QFP
DIP
Package Description
HVSON, SOLCC8,.25
DIP-8
Pin Count
8
8
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Clock Frequency-Max (fCLK)
25 MHz
80 MHz
Data Retention Time-Min
20
20
Endurance
100000 Write/Erase Cycles
100000 Write/Erase Cycles
JESD-30 Code
R-PDSO-N8
R-PDIP-T8
Length
6 mm
9.27 mm
Memory Density
16777216 bit
16777216 bit
Memory IC Type
FLASH
FLASH
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
8
8
Number of Words
2097152 words
2097152 words
Number of Words Code
2000000
2000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
2MX8
2MX8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
HVSON
DIP
Package Equivalence Code
SOLCC8,.25
DIP8,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
IN-LINE
Parallel/Serial
SERIAL
SERIAL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Programming Voltage
2.7 V
3 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1 mm
5.33 mm
Serial Bus Type
SPI
SPI
Standby Current-Max
0.00001 A
0.000005 A
Supply Current-Max
0.015 mA
0.018 mA
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
NO LEAD
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Type
NOR TYPE
NOR TYPE
Width
5 mm
7.62 mm
Write Protection
HARDWARE/SOFTWARE
HARDWARE/SOFTWARE
Base Number Matches
1
1
Output Characteristics
3-STATE
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Compare W25Q16BVDAIG with alternatives