M24SR02-YDW6T/2
vs
AT88SC0204C-PU
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Not Recommended
|
| Ihs Manufacturer |
STMICROELECTRONICS
|
MICROCHIP TECHNOLOGY INC
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
5A992.C
|
| HTS Code |
8542.32.00.51
|
8523.52.00.90
|
| Factory Lead Time |
10 Weeks
|
|
| Samacsys Manufacturer |
STMicroelectronics
|
|
| JESD-609 Code |
e4
|
|
| Memory IC Type |
EEPROM
|
CRYPTO MEMORY
|
| Moisture Sensitivity Level |
1
|
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Base Number Matches |
1
|
1
|
| Package Description |
|
0.300 INCH, GREEN, PLASTIC, MS-001BA, DIP-8
|
| JESD-30 Code |
|
R-PDIP-T8
|
| Length |
|
9.271 mm
|
| Memory Density |
|
2048 bit
|
| Memory Width |
|
8
|
| Number of Functions |
|
1
|
| Number of Terminals |
|
8
|
| Number of Words |
|
256 words
|
| Number of Words Code |
|
256
|
| Operating Mode |
|
SYNCHRONOUS
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Organization |
|
256X8
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
DIP
|
| Package Equivalence Code |
|
DIP8,.3
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
IN-LINE
|
| Seated Height-Max |
|
5.334 mm
|
| Supply Voltage-Max (Vsup) |
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
|
2.7 V
|
| Surface Mount |
|
NO
|
| Technology |
|
CMOS
|
| Terminal Form |
|
THROUGH-HOLE
|
| Terminal Pitch |
|
2.54 mm
|
| Terminal Position |
|
DUAL
|
| Width |
|
7.62 mm
|
|
|
|
Compare M24SR02-YDW6T/2 with alternatives
Compare AT88SC0204C-PU with alternatives