M24M01-RDW6P/K vs 24LC1025T-I/P feature comparison

M24M01-RDW6P/K STMicroelectronics

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24LC1025T-I/P Microchip Technology Inc

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Part Life Cycle Code Not Recommended Active
Ihs Manufacturer STMICROELECTRONICS MICROCHIP TECHNOLOGY INC
Package Description TSSOP-8 0.300 INCH, ROHS COMPLIANT, PLASTIC, DIP-8
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Alternate Memory Width 1
Clock Frequency-Max (fCLK) 1 MHz 0.4 MHz
JESD-30 Code R-PDSO-G8 R-PDIP-T8
Length 4.4 mm 9.271 mm
Memory Density 1048576 bit 1048576 bit
Memory IC Type EEPROM EEPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 131072 words 131072 words
Number of Words Code 128000 128000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 128KX8 128KX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH IN-LINE
Parallel/Serial SERIAL SERIAL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Seated Height-Max 1.2 mm 5.334 mm
Serial Bus Type I2C I2C
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 1.8 V 2.5 V
Supply Voltage-Nom (Vsup) 2.5 V 2.5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 0.65 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 3 mm 7.62 mm
Write Cycle Time-Max (tWC) 5 ms 5 ms
Base Number Matches 1 1
Pbfree Code Yes
Rohs Code Yes
Part Package Code DIP
Pin Count 8
Additional Feature 200 YEARS DATA RETENTION
Data Retention Time-Min 200
JESD-609 Code e3
Qualification Status Not Qualified
Terminal Finish MATTE TIN

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